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E9000 Server Compute Node CH222 Hardware Structure

The CH222 storage expansion compute node (CH222 for short) is a full-width compute node based on Intel® latest Romley processor platform and features superior computing performance and scalability by supporting a maximum of fifteen 2.5-inch disks. The CH222 supports disk hot swapping.
The CH222 is installed in a E9000 chassis and managed by the MM910 management module in a centralized manner.
The CH222 is suitable for big-data analysis and processing applications that require large storage capacity and high computing performance, such as videos, searches, and biological sciences.
032 CH222_
Figure 1 shows the components of the CH222.
sesa_inst_31

1 RAID controller card 2 (Optional) USB flash drive
3 (Optional) TPM 4 DIMM
5 Hard disk tray 6 CPU
7 Mainboard 8 Heat sink
9 Mezz module 10 iBBU
11 (Optional) PCIe card 12 (Optional) PCIe card tray
13 Hard disk baseboard 14 Hard disk
15 Hard disk backboard 16 (Optional) USB 2.0
No. Item Description
1 RAID
controller
card
The RAID controller card externally connects to
hard disks to expand the storage capacity of the
compute node. The RAID controller card provides
eight Serial Attached SCSI (SAS) or Serial
Advanced Technology Attachment (SATA) ports
for connecting disks and expands the number of
SAS or SATA ports to 15 through the midplane.
The mainboard supports RAID controller cards
with the LSISAS2208 and LSISAS2308 chips.
LSISAS2208: supports RAID 0, 1, 5, 6, 10, 50, and 60.
LSISAS2308: supports RAID 0, 1, 1E, and 10.
2 (Optional)
USB flash
drive
The mainboard provides a flash storage module
with a maximum capacity of 8 GB as the startup media.
3 (Optional)
TPM
The Trusted Platform Module (TPM) is a security
solution that complies with the Trusted Computing
Group (TCG) standards. It enhances platform
security by preventing viruses or unauthorized
operations.
4 DIMM Up to 24 dual in-line memory module (DIMM) slots
for installing DIMMs (12 DIMMs for each CPU).
Maximum memory speed: 1866 MHz
Memory protection: error-correcting code
(ECC), mirroring, and sparing.
DIMM type: registered DIMM (RDIMM) and
load-reduced DIMM (LRDIMM). A compute
node does not allow mixed use of DIMM types
(RDIMMs and LRDIMMs) or DIMM specifications
(such as the capacity, bit width, number of
ranks, and height). Therefore, all DIMMs on
a compute node must use the same BOM
number. For details about the BOM numbers,
see Huawei Server Compatibility Checker.
RDIMMs: up to 768 GB for 24 x 32 GB
RDIMMs and two CPUs
LRDIMMs: up to 768 GB for 24 x 32 GB
LRDIMMs and two CPUs
5 Hard disk
tray
The hard disk tray on the CH222 mainboard
does not hold hard disks.
6 CPU The mainboard supports one or two CPUs.
The following CPUs are supported:
Intel  Xeon  E5-2600 (Sandy Bridge-EP)
CPUs of 60 W, 70 W, 80 W, 95 W, 115 W,
130 W, and 135 W, with a maximum of 12
cores per CPU.
Intel  Xeon  E5-2600 v2 (Ivy Bridge-EP)
CPUs of 70 W, 80 W, 95 W, 115 W, 130 W,
and 135 W, with a maximum of 12 cores per CPU.
Each CPU integrates a memory controller for supporting four DDR3 memory channels. Each
channel supports three DDR3 DIMMs of
1333 MHz, 1600 MHz, or 1866 MHz.
Each CPU integrates a PCIe controller for
supporting PCIe 3.0, and provides 40 lanes.
Every two CPUs are interconnected through
two QuickPath Interconnect (QPI) links, with
each link delivering up to 8.0 GT/s.
The maximum core frequency supported by
the CPUs reaches 3.5 GHz.
7 Mainboard The mainboard holds the CPUs, DIMMs, hard disk
interface modules, power control module, iMana
200 (integrated management module), logic
module, chipset and display adapter.
The server chipset is the Platform Controller Hub
(PCH) using the Intel  C602 chip.
A video chip with 16 MB display memory integrated
into the FPGA chip of iMana 200. The maximum
resolution is 1280 x 1024 at 60 Hz with 16 M colors.
8 Heat sink The heat sink is used to cool CPUs. Each CPU
is configured with one heat sink.
9 Mezz module The mainboard provides two mezzanine card
connectors to connect to the switch modules or
pass-through modules through the backplane.
The upper mezzanine card is Mezz 1, and the
lower one is Mezz 2.
Socket CPU 1 provides PCIe x16 bandwidth for
connecting to Mezz 1 and Mezz 2 respectively.
Mezz 1 connects to slots 2X and 3X at the rear
of the E9000 chassis.
Mezz 2 connects to slots 1E and 4E at the rear
of the E9000 chassis.
10 iBBU When the LSISAS2208 controller card is installed,
you can install an iBBU to protect data from
power failures.
11 (Optional)
PCIe card
Standard PCIe card. The PCIe card can be an
400 GB, 800 GB, 1.2 TB, or 2.4 TB PCIe SSD.
If PCIe card is configured, no DIMMs can be
inserted into the six DIMM slots below the PCIe
card due to space limitations.
12 (Optional)
PCIe card
tray
The PCIe card tray is placed above the DIMMs.
Each PCIe card tray provides one PCIe 3.0 x16
slot by using a riser card.
13 Hard disk
baseboard
The hard disk baseboard helps supply power
and connects to the mainboard.
14 Hard disk The compute node supports a maximum of fifteen
2.5-inch hard disk drives (HDDs) or SSDs. Mixed
configuration of HDDs and SSDs is supported.
The hard disk backplane provides fifteen Serial
Attached SCSI (SAS) and Serial Advanced
Technology Attachment (SATA) ports for
connecting SAS and SATA hard disks. Each hard
disk is hot-swappable and can be installed and
removed individually.
15 Hard disk
backboard
The hard disk backboard helps expand storage
capacity and control hard disks in real time.
16 (Optional)
USB 2.0
The mainboard provides a built-in USB port for
connecting to a USB 2.0 device within the
dimensions of 33.9 mm * 14.5 mm * 7.12 mm.

Figure 2 shows the positions of connectors and other components on the CH222 mainboard.
sgca_inst_15

1 HDD Backplane Connector 2 TPM Card Connector
3 HDD Tray 4 PCH(Platform Control Hub)
5 USB Flash drive connector 6 HLY indicator
7 UID button/indicator 8 Power button/indicator
9 High-density Port 10 BIOS Battery
11 USB Port 12 Expansion Card Connector 2
13 Expansion Card Connector
1 (for connecting to a PCIe card)
14 RAID Card Connector
15 Mezzanine Card Connector 2 16 Mezzanine Card Connector 1
17 PCIe Card Power Connector 18 Positioning Pin
19 Midplane Signal Connector 20 Mezzanine Card Tray
21 Midplane Power Connector

Figure 3 shows the positions of connectors and other components on the CH222 hard disk backboard.
sesa_inst_04

1 Power connector, connecting to
the power connector on the
hard disk baseboard
2 Signal connector, connecting to
the signal connector on the
hard disk baseboard
3 Mini SAS connector,
connecting to the mainboard
4 SAS connector
5 Hard disk indicator 6 Peripheral Component
Interconnect Express (PCIe)
connector, connecting to
the panel indicators

Figure 4 shows the positions of connectors and other components on the CH222 hard disk baseboard.
sesa_inst_05

1 The button that perceives
whether the hard disk drawer
is pulled out
2 Power connector, connecting
to the chassis backboard
3 Power connector, connecting to
the power connector on the
hard disk backboard
4 Signal connector, connecting
to the signal connector on
the hard disk backboard
5 High-speed signal connector,
connecting to the mainboard

E9000 _全宽 半宽
HUAWEI E9000 Blade Server Compute nodes configurations as below :
03054855 IT1DSRCA06 Romley EP computes the node-CH121
03055640 IT11SRCC02 The Romley EP computes the node-CH140
03054861 IT1DGRUA03 4 * X8 PCIe Resource Extension The Romley EP compute node, -CH220
03054862 IT1DGRUA04 2 * X16 PCIe Resource Extension The Romley EP compute node, -CH221
03054852 IT1DSESA02 15 * 2.5 “HDD storage expansion Romley EP compute node -CH222
03030QMF IT1DSRCD03 Romley, 4P, 48DIMM Compute the node -CH240
03054986 IT11SBCA03 Boxboro EX RAID 0/1 compute node -CH242
03055236 IT11SBCA05 Boxboro EX RAID 0/1/10/5/50/6/60 1GB Cache Compute node -CH242
03030SAB IT11SBCB01 Brickland EX compute node CH242 V3 8HDD
03030SAD IT11SBCB02 Brickland EX compute node CH242 V3 4HDD
Cables and accessories for options:
04050233 C1M254BK00 (SFP + 20M) – (CC2P0.254 Black) – (SFP + 20M) – Indoor flame retardant low smoke and halogen free cable – SFP + Cable – 1m-
04050693 CFDR1M (QSFP + 38 male) – (CC8P0.254 black (S)) – (QSFP + 38 male) – For indoor use – High speed cable – FDR high speed cable
04050185 C0CC2P000 High-speed cable-SFP + high-speed cable -3m- (SFP + 20M) – (CC2P0.254 black) – (SFP + 20M) – indoor flame retardant low smoke zero halogen
04050694 CFDR3M (QSFP + 38 male) – (CC8P0.32 black (S)) – (QSFP + 38 male) – For indoor use – High-speed cable – FDR high-speed cable –
04050450 SFP-H10G-CU5 (SFP + 20M) – (SFP + 20M) – (SFP + 20M) – Indoor type flame retardant low smoke and halogen free cable – SFP + Cable – 5m-
04050186 C0CC2P001 High-speed cable-SFP + high-speed cable -10m- (SFP + 20M) – (CC2P0.5 black) – (SFP + 20M) – indoor flame retardant low smoke zero halogen
04050516 SFP-H10G-ACU10 (SFP + 20M) – (CC2P0.32 Black) – (SFP + 20M) – Indoor flame retardant low smoke zero halogen-free high-speed cable – active SFP +
06010162 NSSDISK01 USB Flash Module-USB Flash Module-USB Flash Module-No information available.
06010186 NSSFD8G00 Other storage media-Storage-State Flash Disk-8.0G / USB 2.0 interface
03021GRU BC0MTPMAE600 TPM card
21240469 ESLIDE L-shaped slide
21240817 EGUIDER05 Telescopic slide
06020088 NDVDRWU00 CD-DVD-RW 24X / DVD 8X-USB 2.0-External-USB 2.0 5V Power Supply -All
E9000 _后正视图-LIUA
 

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